The degradation process in thin-film AlCu metallizations caused by a thermal stress is taken into account. The thermal stress has been applied by means of an Automatic Measurement System, previously designed and implemented. Reliability tests have been performed at 150°C and 220°C on different kinds of test structures. Data are collected and a comparison of behaviors of samples is possible.

Reliability tests for thermal aging of thin-film AlCu metallizations / Catelani, M; Nicoletti, R.. - STAMPA. - 2:(2001), pp. 855-859. (Intervento presentato al convegno 18th IEEE Instrumentation and Measurement of Informatics -Rediscovering Measurement in the Age of Informatics tenutosi a Budapest, hun nel 2001).

Reliability tests for thermal aging of thin-film AlCu metallizations

CATELANI, MARCANTONIO;
2001

Abstract

The degradation process in thin-film AlCu metallizations caused by a thermal stress is taken into account. The thermal stress has been applied by means of an Automatic Measurement System, previously designed and implemented. Reliability tests have been performed at 150°C and 220°C on different kinds of test structures. Data are collected and a comparison of behaviors of samples is possible.
2001
Conference Record - IEEE Instrumentation and Measurement Technology Conference
18th IEEE Instrumentation and Measurement of Informatics -Rediscovering Measurement in the Age of Informatics
Budapest, hun
2001
Catelani, M; Nicoletti, R.
4a - Articolo in atti di congresso
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Utilizza questo identificatore per citare o creare un link a questa risorsa: https://hdl.handle.net/2158/1050217
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