The degradation process in thin-film AlCu metallizations caused by a thermal stress is taken into account. The thermal stress has been applied by means of an Automatic Measurement System, previously designed and implemented. Reliability tests have been performed at 150°C and 220°C on different kinds of test structures. Data are collected and a comparison of behaviors of samples is possible.
Reliability tests for thermal aging of thin-film AlCu metallizations / Catelani, M; Nicoletti, R.. - STAMPA. - 2:(2001), pp. 855-859. (Intervento presentato al convegno 18th IEEE Instrumentation and Measurement of Informatics -Rediscovering Measurement in the Age of Informatics tenutosi a Budapest, hun nel 2001).
Reliability tests for thermal aging of thin-film AlCu metallizations
CATELANI, MARCANTONIO;
2001
Abstract
The degradation process in thin-film AlCu metallizations caused by a thermal stress is taken into account. The thermal stress has been applied by means of an Automatic Measurement System, previously designed and implemented. Reliability tests have been performed at 150°C and 220°C on different kinds of test structures. Data are collected and a comparison of behaviors of samples is possible.I documenti in FLORE sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.