This study investigates a jet-impingement cooling system using an actively heated steel plate to emulate electronic device behavior. Infrared thermography and filtering techniques are employed to estimate local convective heat transfer. Results are validated through numerical simulations under varying flow conditions.

Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices / Gerbino, Filippo; Cattani, Luca; Bozzoli, Fabio; Spaggiari, Davide; Cova, Paolo; Menozzi, Roberto. - ELETTRONICO. - (2025), pp. 1-4. ( 31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025 ita 2025) [10.1109/therminic65879.2025.11216885].

Thermal Characterization of a Novel Direct Cooler Design for Modular Power Devices

Bozzoli, Fabio;
2025

Abstract

This study investigates a jet-impingement cooling system using an actively heated steel plate to emulate electronic device behavior. Infrared thermography and filtering techniques are employed to estimate local convective heat transfer. Results are validated through numerical simulations under varying flow conditions.
2025
31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025 - Proceedings
31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025
ita
2025
Gerbino, Filippo; Cattani, Luca; Bozzoli, Fabio; Spaggiari, Davide; Cova, Paolo; Menozzi, Roberto
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Utilizza questo identificatore per citare o creare un link a questa risorsa: https://hdl.handle.net/2158/1453181
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