Microelectronic devices are required to have high reliability when subjected to stresses within the maximum ratings. Nevertheless, in multilayered integrated circuits (ICs) several degradation phenomena can generate failures. In this paper, the degradation process in thin-film AlCu metallizations by means of the thermal stress test is taken into account. To this aim, an automatic measurement system with programmable performances is designed and realized in order to induce thermal degradation and compute data. The measurement system can be easily replicated with simple equipment and user-friendly LabView software.
Automatic Measurement System for Stress-Voiding Analysis in Thin-Film AlCu Metallizations / M. CATELANI; R.NICOLETTI. - In: IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT. - ISSN 0018-9456. - STAMPA. - 51, n°3:(2002), pp. 401-407.
Automatic Measurement System for Stress-Voiding Analysis in Thin-Film AlCu Metallizations
CATELANI, MARCANTONIO;
2002
Abstract
Microelectronic devices are required to have high reliability when subjected to stresses within the maximum ratings. Nevertheless, in multilayered integrated circuits (ICs) several degradation phenomena can generate failures. In this paper, the degradation process in thin-film AlCu metallizations by means of the thermal stress test is taken into account. To this aim, an automatic measurement system with programmable performances is designed and realized in order to induce thermal degradation and compute data. The measurement system can be easily replicated with simple equipment and user-friendly LabView software.
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