Optimization of the soldering process with ECAs in electronic equipments: characterization measurement and experimental design

In this paper, two different types of conductive adhesives, characterized by different chemical structures and compositions, are experimented and tested. Then, being the lead free soldering process characterized by several critical factors, the statistical approach aims to optimize this process. Experimental results obtained by testing samples with Electrically Conductive Adhesive materials prove the validity of the study. The paper value is in the application of a statistical approach to these adhesive materials in order to achieve the optimization of the soldering process through an experimental design with a small numbers of treatment combinations, satisfying anyway stringent requirements and achieving robust electrical interconnections.