RoHs requirements for electronic applications: measurements of characteristics of silver epoxy adhesives solder joints

It is emerged the necessity to modify the soldering process of all the devices under the RoHS European Directive [1], in order to eliminate the presence of lead. So our research is oriented to study the use of new materials for connections in electronic devices and to measure their characteristics and reliability performances. In this paper it is shown the preliminary characterization of a new study of the use of conductive materials without lead for the adhesion of the plate, which has piezoelectric properties, with the fingers' comb. Found a possible variability of the samples production process, it appeared opportune to apply a Design of Experiments method (D.o.E.) [2], to understand the degrees of correlation between the interested variables. After having chosen the output control characteristics of the process, (measures of electrical resistance of every single element of transducer's array) the variables, which are potentially responsible of the uncertainty on the aforesaid measures, have been characterized. The samples and the measurement system are implemented and the results are discussed in this paper.