Vibration Tests on Prototypes of Ultrasound Array Transducer: Evaluation of Soldering Electrical Performances

Mechanical stresses, as vibrations, are the main common types of solicitation to which electronic equipment can be subjected during its useful life. For this reason drop or shock tests become important for such device; the use of a shaker system, able to produce sinusoidal and random vibrations, can simulate the operating conditions in a less expensive and faster way. In this paper the planning and implementation of vibration tests on prototypes of piezoelectric transducers is proposed. In fact the devices taken into consideration are subjected to an innovative soldering process in compliance to RoHS directive. In particular, silver conductive adhesive as soldering material is used and measurements of the electrical resistance are carried out in order to evaluate the resistance degree of the samples to mechanical stresses.