Characterisation of Electrical Properties of Printed Circuit Board Base Laminates

New dielectric materials have been introduced for printed circuit board (PCB) design, such as Thermount® and Polyimide with the aim to match the requirements for high speed and high density of electronic devices. Before they can completely replace the well known space qualified material Epoxy FR-4, is necessary to investigate more deeply their electrical and mechanical properties. The scope of this study was to report out a quantitative characterization of the surface resistivity (RS) for different material samples under various testing conditions that include relative humidity (RH), temperature (T), solder flux contamination and corona discharge (CD). The surface resistivity have been measured for 4 sets of samples under a combination of testing conditions useful for the qualification process of materials operating in space environment.