Winner of the Best paper award ABSTRACT: In ultrasound (US) research, a key role is currently played by open platforms, i.e. flexible scanners with unlimited access to raw echo-data, which facilitate the implementation and experimental test of new echographic methods. The methods proposed by research laboratories are increasingly demanding in terms of computational power and number of transmit/receive channels necessary for a suitable control of US array probes. In this paper, the basic module of a new 256-channel open platform is described. Such module, called Front-end (FE) board, integrates all of the electronics to simultaneously control 32 probe elements. Each FE board hosts four analog front-end chips, two DSPs and one FPGA, and is connected to the other boards in a ring with total I/O bandwidth of 80 Gbit/s full-duplex.

Multicore DSP-based Front-end board for a high channel, modular, ultrasound research system / A. Dallai;E. Boni;L. Bassi;S. Ricci;F. Guidi;P. Tortoli. - ELETTRONICO. - (2014), pp. 312-315. (Intervento presentato al convegno 2014 6th European Embedded Design in Education and Research Conference (EDERC) tenutosi a Milano, Italia nel September 2014) [10.1109/EDERC.2014.6924411].

Multicore DSP-based Front-end board for a high channel, modular, ultrasound research system

DALLAI, ALESSANDRO;BONI, ENRICO;BASSI, LUCA;RICCI, STEFANO;GUIDI, FRANCESCO;TORTOLI, PIERO
2014

Abstract

Winner of the Best paper award ABSTRACT: In ultrasound (US) research, a key role is currently played by open platforms, i.e. flexible scanners with unlimited access to raw echo-data, which facilitate the implementation and experimental test of new echographic methods. The methods proposed by research laboratories are increasingly demanding in terms of computational power and number of transmit/receive channels necessary for a suitable control of US array probes. In this paper, the basic module of a new 256-channel open platform is described. Such module, called Front-end (FE) board, integrates all of the electronics to simultaneously control 32 probe elements. Each FE board hosts four analog front-end chips, two DSPs and one FPGA, and is connected to the other boards in a ring with total I/O bandwidth of 80 Gbit/s full-duplex.
2014
2014 6th European Embedded Design in Education and Research Conference (EDERC)
2014 6th European Embedded Design in Education and Research Conference (EDERC)
Milano, Italia
September 2014
A. Dallai;E. Boni;L. Bassi;S. Ricci;F. Guidi;P. Tortoli
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Utilizza questo identificatore per citare o creare un link a questa risorsa: https://hdl.handle.net/2158/914130
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